Formic Acid Blown EPIC Foams

Patent Title: ISOCYANATE-BASED TEMPERATURE-RESISTANT FOAMS WITH HIGH FLAME RESISTANCE

 Number/Link: WO2016/131874

Applicant/Assignee: BASF, Covestro

Publication date: 25-08-2016

Gist”:  One shot rigid isocyanate-epoxy foams blown with formic acid

Why it is interesting: This is the first in a series of (at least) 3 patent applications apparently resulting from a cooperation between BASF and Covestro on epoxy-isocyanate (“EPIC”) foams.  The other applications are WO2016/131878 and WO2016/131880 published on the same date. More publications may follow.
The current invention is about temperature-resistant foams with reportedly very high mechanical properties prepared form a one-shot system comprising a (pref.) high functional MDI, a (pref.) bisphenol-A or bisphenol-F polyglycidylether, at least one reactive amine catalyst and a blowing agent comprising formic acid. The ratio of iso to epoxy groups is (pref.) 3:1 to 15:1. The resulting materials are post-cured at 200°C. The foams contain no, or very little, urethane or urea groups and are said to be especially useful in laminates a.o.  In the examples foams with densities of 25-35 kg/m³ with a thermal conductivity as low as 20 mW/mK are shown.

Bisphenol-F diglycidylether

Bisphenol-F diglycidylether

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Spirocyclic Chain Extenders in TPU

Patent Title: THERMOPLASTIC POLYURETHANE WITH HIGH HEAT RESISTANCE

 Number/Link: W02016025421  WO2016025423

Applicant/Assignee: Lubrizol

Publication date: 18-02-2016

Gist”: Use of spirocyclic chain extenders increases heat resistance of TPU

Why it is interesting: Both these patent applications are about the use of alkylene-substituted spirocyclic diols to improve the heat resistance of thermoplastic polyurethanes. In the WO..21 case the diol is used together with MDI and a polycarbonate diol resulting in high heat resistance TPU useful e.g for cable and wire coatings.  In the WO..23 case the spirocyclic diol is used together with MDI and a polyether polyol (PEGs) resulting in TPU with high heat resistance and moisture vapour transmission.  The spirocyclic diol used in the examples is 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane.

3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane

3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane

Polyurethane Rigid Foam Containing Lignin

Title: COMPOSITIONS OF PHENOLIC BIOPOLYMERS

 Number/Link:WO2015/055662

Applicant/Assignee: Solvay

Publication date: 23-04-2015

Gist”: Lignin is emulsified in a halogenated polyol and then used to prepare rigid foams.

Why it is interesting: This case is about yet another attempt to incorporate lignin into polyurethane materials. In this invention lignin is dispersed in a halogenated polyol using a suitable milling process. The polyol is preferably a brominated ‘rigid’ polyether.  The dispersed lignin (pref.) has a (d90) mean particle size of less than 100μm and is used in an amount of up to about 50% on the brominated polyether.  The lignin dispersion can then be used together with other polyols in rigid foam formulations.  The resulting foams should have improved flammability properties and the lignin is said to have no negative effect on thermal insulation properties.

Part of a typical lignin structure

Part of a typical lignin structure