Formic Acid Blown EPIC Foams

Patent Title: ISOCYANATE-BASED TEMPERATURE-RESISTANT FOAMS WITH HIGH FLAME RESISTANCE

 Number/Link: WO2016/131874

Applicant/Assignee: BASF, Covestro

Publication date: 25-08-2016

Gist”:  One shot rigid isocyanate-epoxy foams blown with formic acid

Why it is interesting: This is the first in a series of (at least) 3 patent applications apparently resulting from a cooperation between BASF and Covestro on epoxy-isocyanate (“EPIC”) foams.  The other applications are WO2016/131878 and WO2016/131880 published on the same date. More publications may follow.
The current invention is about temperature-resistant foams with reportedly very high mechanical properties prepared form a one-shot system comprising a (pref.) high functional MDI, a (pref.) bisphenol-A or bisphenol-F polyglycidylether, at least one reactive amine catalyst and a blowing agent comprising formic acid. The ratio of iso to epoxy groups is (pref.) 3:1 to 15:1. The resulting materials are post-cured at 200°C. The foams contain no, or very little, urethane or urea groups and are said to be especially useful in laminates a.o.  In the examples foams with densities of 25-35 kg/m³ with a thermal conductivity as low as 20 mW/mK are shown.

Bisphenol-F diglycidylether

Bisphenol-F diglycidylether

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1K Dual Cure Polyurethane Adhesive

Patent Title: DUAL CURE 1K PU ADHESIVE FORMULATIONS USING MATRIX ENCAPSULATED POLYAMINES

 Number/Link: W02016022346

Applicant/Assignee: Dow

Publication date: 11-02-2016

Gist”: Encapsulated polyamines are added to a moisture curing adhesive

Why it is interesting: One component (1K) PU adhesives are either NCO-ended prepolymers cured by atmospheric moisture, or OH-ended prepolymers containing encapuslated or blocked isocyanates and which are cured by heat.  According to this invention a 1K adhesive curable by both moisture and heat can be made by incorporating an encapuslated polyamine into a 1K mositure curing prepolymer. The amine is solid at room temperature (e.g. 1,12-dodecanediamine) and is mixed with a (semi-)crystalline termoplastic with a well defined melting point, e.g. a polyacrylate or polyolefine before being added to the adhesive. Dual cure 1K adhesives allow for heat-curing the adhesive at critical spots to providing stability to an assembly.  The adhesives are said to be especially useful for the automotive industry.

1,12-dodecanediamine

1,12-dodecanediamine

 

Insulating Wood-Aerogel Composites

Title: REINFORCED ORGANIC NATURAL FIBER COMPOSITES

 Number/Link: WO2015/144267

Applicant/Assignee: Huntsman

Publication date: 1-10-2015

Gist”: Aerogel particles are incorporated in composite wood boards

Why it is interesting: Composite wood products (OSB, MDF..) are  well known and popular construction materials which are produced by compressing wood fibers (or flakes and the like) together with a binder like e.g. a polymeric MDI. Typically these materials show thermal conductivity values of about 50 mW/m.K at densities of around 200 kg/m³.  According to this invention these insulation values can be significantly improved by incorporating (a large amount of) hydrophobic nanoporous particles and binding the composite with an in-water emulsified isocyanate. In the examples silica aerogel particles and wood fibers are mixed an bonded with an emulsifiable MDI. The amount of particles ranges from about 25 to 50% (w/w) resulting in composites with densities below 200 kg/m³ and insulation values of about 20 to 30 mW/mK.

Medium density fibreboard (MDF).

Medium density fibreboard (MDF).

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