Patent Title: DUAL CURE 1K PU ADHESIVE FORMULATIONS USING MATRIX ENCAPSULATED POLYAMINES

 Number/Link: W02016022346

Applicant/Assignee: Dow

Publication date: 11-02-2016

“Gist”: Encapsulated polyamines are added to a moisture curing adhesive

Why it is interesting: One component (1K) PU adhesives are either NCO-ended prepolymers cured by atmospheric moisture, or OH-ended prepolymers containing encapuslated or blocked isocyanates and which are cured by heat.  According to this invention a 1K adhesive curable by both moisture and heat can be made by incorporating an encapuslated polyamine into a 1K mositure curing prepolymer. The amine is solid at room temperature (e.g. 1,12-dodecanediamine) and is mixed with a (semi-)crystalline termoplastic with a well defined melting point, e.g. a polyacrylate or polyolefine before being added to the adhesive. Dual cure 1K adhesives allow for heat-curing the adhesive at critical spots to providing stability to an assembly.  The adhesives are said to be especially useful for the automotive industry.

1,12-dodecanediamine